			Volume 4, Number 3, September 2004 (ISSN 1598-1657)


			Special Issue on System Integration Technologies for Wireless Terminal

			Editorial ································································································································································Kwyro Lee	i

			MOSFET Model HiSIM Based on Surface-Potential Description for Enabling Accurate RF-CMOS Design ·············· ······················M. Miura-Mattausch, H.J.Mattausch, T. Ohguro, T. Lizuka, M. Taguchi, S. Kumashiro, and S. Miyamoto	133
			Accurate Compact MOSFET Modeling Scheme for Harmonic Distortion Analysis ························································· ·····················································································B. Iniguez, R. Picos, I. Kwon, M. S. Shur, T. A. Fjeldly, and K. Lee	141
			On-Chip Spiral Inductors for RF Applications: An Overview ·····················································Ji Chen and Juin J. Liou	149
			Optimization of Low Power CMOS Baseband Analog Filter-Amplifier Chain for Direct Conversion Receiver ·············· ························································································································Minkyung Lee, Ickjin Kwon, and Kwyro Lee	149
			System Level Design of Multi-Standard Receiver Using Reconfigurable RF Block ···························································· ·····································································································Changjae Kim, Young-Kyun Jang, and Hyung-Joun Yoo	168
			A System-in-Package (SiP) Integration of a 62GHz Transmitter For mm-wave Communication Terminals Applications ··································································································································· Young Chul Lee and Chul Soon Park	182
			A Wafer Level Packaged Limiting Amplifier for 10Gbps Optical Transmission System ·················································· ·································Chul-Won Ju, Byoung-Gue Min, Seong-Il Kim, Kyung-Ho Lee, Jong-Min Lee, and Young-il Kang	189
			Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals ·············································· ·························································································R.J. Gutmann, A. Y. Zeng, S. Devarajan, J. Q. Lu, and K. Rose	196
			Partial Matched Filter for Low Power and Fast Code Acquisition of DSSS-CPFSK Signals ··············· Huyng Chul Park	204
			A Noncoherent UWB Communication System for Low Power Applications ·································································· ···································································Suckchel Yang, Jung-wan Park, Yong Moon, Won Cheol Lee, and Yoan Shin	210

			High -Rate Laser Ablation For Through-Wafer Via Holes in SiC Substrates and GaN/AlN/SiC Templates ······················ ················································S. Kim, B. S. Bang, F. Ren, J. d'Entremont, W. Blumenfeld, T. Cordock, and S. J. Pearton	217
			Cell Signal Distribution Characteristics For High Density FeRAM ···················································································· ···························Hee-Bok Kang, Young-Jin Park, Jae-Jin Lee, Jin-Hong Ahn, Man-Young Sung, and Young-Kwon Sung	222
			Optimization of Gate Stack MOSFETs with Quantization Effects ··················································································· ········································· Tina Mangla, Amit Sehgal, Manoj Saxena, Subhasis Haldar, Mridula Gupta, and R. S. Gupta	228
			Optimization of InAlAs/InGaAs HEMT performance for microwave frequency applications and reliability ·················· ·········································································Ritesh Gupta, Sandeep Kumar Aggarwal, Mridula Gupta, and R. S. Gupta	240

			Call Papers for March 2005 Special Issue on Microtransducer Technologies
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